Semiconductor substrate, and semiconductor chip and stacked semiconductor package having the same

A semiconductor chip comprising:

• a substrate body divided into device regions and a peripheral region generally outside the device regions, and having one surface generally facing away from an other surface, and trenches which are defined generally in the device regions substantially on the one surface, an active layer formed substantially in the trenches and made of polysilicon;
• semiconductor devices formed substantially over the active layer;
• and
• through electrodes substantially passing through the peripheral region of the substrate body.

A stacked semiconductor package comprising:

• a plurality of semiconductor chips each including a semiconductor substrate including a substrate body divided into device regions and a peripheral region generally outside the device regions, and having one surface generally facing away from an other surface, and trenches which are defined generally in the device regions substantially on the one surface, and an active layer formed substantially in the trenches and made of polysilicon;
• semiconductor devices formed substantially over the active layer;
• and through electrodes passing through the peripheral region of the substrate body, the plurality of semiconductor chips being stacked such that their through electrodes are electrically connected with one another;
• and
• conductive connection members electrically connecting the through electrodes of the stacked semiconductor chips.