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US 2013/0240484 A1Published application
Electroless copper alloy capping
AssigneeLam Research Corporation
InventorArtur KOLICS
Life of this patent
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Abstract
A method for providing copper filled features in a layer is provided. A deposition of copper is provided to fill features in the layer. Tops of the copper deposit are cleaned to remove copper or copper oxide at tops of the copper deposit. A selective copper alloy plating on the tops of the copper deposit is provided. The copper deposit and selective copper alloy plating are annealed.
Claims20
A method for providing copper filled features in a layer, comprising:
- providing a deposition of copper to fill features in the layer;
- cleaning tops of the copper deposit to remove copper or copper oxide at the tops of the copper deposit;
- providing a selective copper alloy plating on the tops of the copper deposit;
- and
- annealing the copper deposit and selective copper alloy plating.
2 more elements
Dependencies are inferred from the claim text.