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US 2013/0240368 A1Published application
Low internal stress copper electroplating method
AssigneeRohm and Haas Electronic Material LLC
InventorsGeorge R. Allardyce, Gary Hamm, Narsmoul Karaya
Life of this patent
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Abstract
Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.
Claims6
A method comprises:
- a) contacting a substrate with a composition comprising one or more sources of copper ions, one or more suppressors and one or more accelerators in sufficient amounts to provide a copper deposit of matt appearance;
- and
- b) applying a current to the substrate to achieve a current density at or below MattCDmax throughout the substrate to deposit the copper of matt appearance on the substrate.
Dependencies are inferred from the claim text.