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US 2013/0240252 A1Published application
3d-shaped component with a circuit trace pattern and method for making the same
AssigneeTaiwan Green Point Enterprises Co., Ltd.
InventorsYen-Chou CHEN, Cheng-Yeh HSIAO, Wen-Pao YANG
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Abstract
A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.
Claims10
A 3D-shaped component with, a circuit trace pattern, comprising:
- a 3D-shaped plastic film, having a first surface;
- and
- a circuit trace pattern, disposed at said first surface of said 3D-shaped plastic film, embedded in said 3D-shaped plastic film, and made from a cured conductive ink.
A method for making a 3D-shaped component having a circuit trace pattern, the method comprising;
- printing a circuit trace pattern of a curable conductive ink on a flat plastic film;
- curing the curable conductive ink on the flat plastic film;
- placing the flat plastic film together with the circuit trace pattern of the cured conductive ink in a mold cavity;
- softening the flat plastic film in the mold cavity by heating;
- and
- deforming the softened flat plastic film to the shape of the mold cavity by applying pressure to the softened flat plastic film so as to form a 3D-shaped plastic film with the circuit trace pattern.
3 more elements
Dependencies are inferred from the claim text.