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US 2013/0240131 A1Published application
Method of fabricating semiconductor device and semiconductor production apparatus
AssigneeKabushiki Kaisha Toshiba
InventorAkira EZAKI
Life of this patent
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Abstract
An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including curving a semiconductor substrate onto which a protection tape is bonded, and removing the protection tape in a state where the semiconductor substrate is curved.
Claims18
A method of fabricating a semiconductor device, comprising:
- curving a semiconductor substrate onto which a protection tape is bonded;
- and
- removing the protection tape in a state where the semiconductor substrate is curved.
A method of fabricating a semiconductor device, comprising:
- curving a semiconductor substrate onto which a protection tape is bonded, the semiconductor substrate having a thickness of smaller than 80 μm;
- bonding a removal tape onto the protection tape;
- and
- integrally removing the removal tape with the protection tape to remove the protection tape from the semiconductor substrate along a direction in which a cross sectional view of the semiconductor substrate is a curved shape, in a state where the semiconductor substrate is curved.
1 more element
A semiconductor production apparatus, comprising:
- a stage having a mounting surface with a curved shape and maintaining a semiconductor substrate onto which a protection tape is bonded, on the mounting surface in a state that the curved shape is maintained;
- and
- a removing unit removing the protection tape bonded onto the semiconductor substrate maintained on the mounting surface.
Dependencies are inferred from the claim text.