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US 2013/0239696 A1Published application
Sensor device with stepped pads for connectivity
AssigneeMeggitt (Orange County), Inc.
InventorJames Letterneau
Life of this patent
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Abstract
A sensor device includes at least one sensor device coupled to a substrate. A solder pad interface includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad. A cable with a plurality of cable leads, is configured for each of a cable lead to be coupled to a solder pad.
Claims19
A sensor device, comprising:
- a substrate;
- at least one sensor coupled to the substrate;
- and
- a solder pad interface that includes a plurality of steps, with at least a portion of the steps positioned at different planes, each of a step having a solder pad;
- a cable with a plurality of cable leads, each of a cable lead being coupled to a solder pad.
2 more elements
Dependencies are inferred from the claim text.