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US 2013/0239591 A1Published application
Thermal electric cooler and method
AssigneeRaytheon Company
InventorRobert R. Clarkson
Life of this patent
Estimating the term…
Abstract
According to an embodiment of the disclosure, a thermal electric cooler is provided that includes a plurality of segments and a plurality of couplers. The segments are coupled in series to form a ladder-configuration string of P-channel chips and N-channel chips. Each segment comprises at least two substrings coupled in parallel. Each substring comprises at least one of the chips. Each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips.
Claims20
A thermal electric cooler, comprising:
- a plurality of segments coupled in series to form a ladder-configuration string of P-channel chips and N-channel chips, wherein each segment comprises at least two substrings coupled in parallel, and wherein each substring comprises at least one of the chips;
- and
- a plurality of couplers, wherein each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips.
A thermal electric cooler, comprising:
- a top substrate;
- a bottom substrate;
- a plurality of P-channel chips and a plurality of N-channel chips coupled between the top substrate and the bottom substrate in rows and columns, wherein each of the columns comprises an alternating pattern of the P-channel chips and the N-channel chips and each of the rows comprises an alternating pattern of pairs of the P-channel chips and pairs of the N-channel chips;
- and
- a plurality of couplers, wherein each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips.
2 more elements
A method comprising:
- coupling at least two substrings in parallel to form each of a plurality of segments;
- and
- coupling the segments in series to form a ladder-configuration string of P-channel chips and N-channel chips for a thermal electric cooler, wherein each substring comprises at least one of the chips.
Dependencies are inferred from the claim text.