Method of manufacturing lead frame and semiconductor package using the lead frame

A method of manufacturing a semiconductor package, comprising:

• providing a lead frame to have a structure comprising a frame portion, a pad portion at a center of the lead frame, and a plurality of lead portions peripherally extending from the frame portion towards the pad portion;
• etching each of the plurality of lead portions to form a support end, a connecting terminal and a jointing end jointing the frame portion with the connecting terminal, the connecting terminal positioned between the jointing end and the support end, a receiving portion cooperatively formed by the connecting terminals, the support ends and the pad portion;
• receiving a first chip in the receiving portion;
• mechanically attaching a second chip to the first chip;
• connecting the second chip to the connecting terminals via a plurality of bonding wires;
• and
• encapsulating the lead frame, the first chip, the second chip and the plurality of bonding wires.