Power and ground vias for power distribution systems

A method comprising:

• providing a power source including a terminal;
• providing one of a power plane and a ground plane;
• and
• forming a via filled with a conductive material that forms a conductive pathway that connects the terminal of the power source to the one of the power plane and the ground plane, wherein the via has a cross-section of at least three partially-overlapping shapes, and wherein each of the shapes partially overlaps at least two of the other shapes.

A method comprising:

• providing a power source including a power supply voltage terminal and a power supply ground terminal;
• providing a power plane;
• providing a ground plane;
• forming a first via filled with a conductive material that forms a first conductive pathway that electrically connects the power plane to the power supply voltage terminal of the power source, wherein the first via has a cross-section of at least partially-overlapping circular shapes, and wherein each one of the circular shapes partially overlaps at least two of the other circular shapes;
• and
• forming a second via filled with a conductive material that forms a second conductive pathway that electrically connects the ground plane to the power supply ground terminal of the power source, wherein the second via has a cross-section of at least three partially-overlapping circular shapes, and wherein each of the circular shapes partially overlaps at least two of the other circular shapes.