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US 2013/0230693 A1Published application
Polyamide resin films and processes for manufacturing them
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorJun Mitadera
Life of this patent
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Abstract
Provided is a windable thin single layer film comprising a xylylenediamine-based polyamide resin. A polyamide resin film comprising a polyamide resin (C) obtained by polycondensing a diamine structural unit of which 70 mol % or more is derived from xylylenediamine (A) with a dicarboxylic acid (B), wherein the film has a thickness of 10 to 50 μm and is textured on the surface.
Claims14
A polyamide resin film comprising:
- a polyamide resin which is a polycondensate of a diamine and a dicarboxylic acid,
- wherein the diamine comprises 70 mol % or more of xylylenediamine, and the polyamide resin film has a thickness of 10 to 50 μm and a surface having a texture.
Dependencies are inferred from the claim text.