Printed circuit board

A method of inspecting a printed circuit board, the method comprising:

• orienting the printed circuit board so that an automatic optical inspection device can view into an opening through the substrate of the board to inspect a solder connection made between the base surface of an electronic component and a facing conducting surface of the substrate;
• and
• inspecting the solder connection;
• wherein the printed circuit board, includes:
• a substrate having an electrically insulating material and a pattern of electrically conductive paths formed on at least one side of the substrate;
• and
• a plurality of electronic components mounted to the substrate in connection with the electrically conductive paths;
• wherein at least one electronic component includes a base solder connection between a base surface of the component and a facing conducting surface of the substrate, the base solder connection being substantially obscured from view from the side of the substrate to which the component is attached, an opening extending through the substrate beneath the base surface of the component so that the base solder connection is visible through the opening.