Semiconductor device and method of manufacture thereof
AssigneeKabushiki Kaisha Toshiba
InventorsYuta MUSHA, Takayuki SAKAI, Hideki OKUMURA, Takahiro KAWANO
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AssigneeKabushiki Kaisha Toshiba
InventorsYuta MUSHA, Takayuki SAKAI, Hideki OKUMURA, Takahiro KAWANO
Estimating the term…
A method for manufacturing a semiconductor device includes forming a first insulating film on inner surfaces of trenches arranged in parallel in a semiconductor layer, forming a control electrode on the first insulating film, and forming a second insulating film on the control electrode, where the upper surface of the second insulating film is lower than the upper end of the first insulating film. In addition, the method includes etching the semiconductor layer to a depth near the upper end of the control electrode and forming a first semiconductor region. The method further includes forming a conductive film and then a second semiconductor region in the upper portion of the first semiconductor region by diffusion of impurities from the conductive film into the upper portion of the first semiconductor region, and forming a contact hole by etching back the conductive layer.
A method for manufacturing a semiconductor device, comprising the steps of:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.