Chip-type ceramic electronic component and producing method thereof

A chip-type ceramic electronic component comprising:

• a ceramic base body having a first end face and a second end face opposed to the first end face, and a plurality of side faces connecting the first end face and the second end face to each other;
• an external electrode extending from one of the first end face and the second end face onto at least one side face of the plurality of side faces and not onto the other of the first end face and the second end face, the external electrode including a tip portion extending onto the at least one side face of the plurality of side faces, wherein the tip portion is constituted by a resin electrode comprising a resin and a conductive component;
• wherein a relationship between Rz1 and Rz2 satisfies the following requirement:
• Rz1>Rz2,
• Rz1>3.3 μm, and
• Rz2<3.2 μm, and
• wherein Rz1 is a ten-point average surface roughness of a first region of a surface of the ceramic base body to which the tip portion of the external electrode is bonded, and Rz2 is a ten-point average surface roughness of a second region of the surface of the ceramic base body where the external electrode is not located.