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US 2013/0220090 A1Published application
Wafer edge trim blade with slots
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Ting KUO, Kei-Wei CHEN, Ying-Lang WANG, Kuo-Hsiu WEI
Life of this patent
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Abstract
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
Claims20
A wafer edge trim blade, comprising:
- a round blade body;
- and
- at least one slot formed inward from an outside edge of the round blade body;
- wherein the at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
1 more element
A method of trimming an edge of a wafer comprising:
- rotating a wafer edge trim blade having at least one slot formed inward from an outside edge of the wafer edge trim blade;
- moving the wafer edge trim blade toward a wafer;
- trimming the edge of the wafer using the wafer edge trim blade;
- and
- removing debris by pushing the debris with the at least one slot.
2 more elements
A wafer edge trim blade, comprising:
- a round blade body;
- and
- multiple slots formed inward from an outside edge of the round blade body and distributed at equal distance around the outside edge;
- wherein the wafer edge trim blade comprises diamond grits and the multiple slots are configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
1 more element
Dependencies are inferred from the claim text.