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US 2013/0210504 A1Published application
Components with mechanically-bonded plastic and methods for forming such components
AssigneeHTC Corporation
InventorJason Donald Mareno
Life of this patent
Estimating the term…
Abstract
Components and methods for forming such components with mechanically-bonded plastic are provided. A representative method includes: providing a metal chassis, the chassis having an opening extending through; placing the chassis in a mold; flowing plastic into the mold such that the plastic flows into the opening, the plastic being mechanically bonded to the metal of the chassis to form an integrated metal and plastic component; and removing the integrated metal and plastic component from the mold.
Claims20
A mobile device comprising:
- a housing comprising:
- a metal chassis having an opening extending there through;
- and
- a plastic part mechanically bonded to the metal of the chassis and spanning the opening.
1 more element
A method for forming a component comprising:
- providing a metal chassis, the chassis having an opening extending through;
- placing the chassis in a mold;
- flowing plastic into the mold such that the plastic flows into the opening, the plastic being mechanically bonded to the metal of the chassis to form an integrated metal and plastic component;
- and
- removing the integrated metal and plastic component from the mold.
2 more elements
Dependencies are inferred from the claim text.