Solid-state image pickup element, method of manufacturing the same, and image pickup apparatus including the same
AssigneeSony Corporation
InventorsItaru Oshiyama, Susumu Hiyama
Life of this patent
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Abstract
A solid-state image pickup element 1 is structured so as to include: a semiconductor layer 2 having a photodiode formed therein, photoelectric conversion being carried out in the photodiode; a first film 21 having negative fixed charges and formed on the semiconductor layer 2 in a region in which at least the photodiode is formed; and a second film 22 having the negative fixed charges, made of a material different from that of the first film 21 having the negative fixed charges, and formed on the first film 21 having the negative fixed charges.
Claims20
-9. (canceled)
An imaging device, comprising:
- a semiconductor layer having a photodiode formed therein, photoelectric conversion being carried out in said photodiode;
- a first film, made of a material containing at least one element of silicon, hafnium, aluminum, tantalum, titanium, yttrium, and lanthanoid, and formed over said semiconductor layer in a region in which at least said photodiode is formed;
- and
- a second film, made of a material different from that of said first film, and formed on said first film.
An image pickup apparatus, comprising:
- a condensing optical portion configured to condense an incident light;
- an imaging device including a first film, made of a material containing at least one element of silicon, hafnium, aluminum, tantalum, titanium, yttrium, and lanthanoid, and formed over said semiconductor layer in a region in which at least said photodiode is formed, a second film, made of a material different from that of said first film, and formed on said first film, the imaging device serving to receive the incident light condensed by the condensing optical portion, thereby carrying out photoelectric conversion for the incident light;
- and
- a signal processing portion configured to process a signal obtained through the photoelectric conversion in said imaging device.
Dependencies are inferred from the claim text.