Gas Dispersion Plate for Plasma Reactor Having Extended Lifetime

A method of extending the useful lifetime of a gas dispersion plate comprising preparing a gas dispersion plate comprising a plate body having a first surface and a second surface, the plate body having at least one injection passage that spans the plate from the first surface to the second surface, the distance along the passage from the first surface to the second surface defining the length of the passage, wherein the injection passage includes an ion trap chamber.

A method of reducing the degradation of an injection passage in a gas dispersion plate, the method comprising preparing a gas dispersion plate comprising a plate body having a first surface and a second surface, the plate body having at least one injection passage that spans the plate from the first surface to the second surface, the distance along the passage from the first surface to the second surface defining the length of the passage, wherein the injection passage includes an ion trap chamber, whereby a gas can flow from the first surface of the plate to the second surface of the plate and the plate body comprising a cooling plate and a cell plate, and a first surface of the cell plate faces the reaction chamber and a second surface of the cell plate faces a first surface of the cooling plate.

A method of reducing the electrical connection of the reaction chamber plasma to gas dispersion plate, the gas dispersion plate comprising a interfacing the non-metallic dispersion plate, the method comprising preparing a plate comprising a plate body having a first surface and a second surface, the plate body having at least one injection passage that spans the plate from the first surface to the second surface, the distance along the passage from the first surface to the second surface defining the length of the passage, wherein the injection passage includes an ion trap chamber, whereby a gas can flow from the first surface of the plate to the second surface of the plate.

A method of reducing the particle generation to reduce particles deposited onto the wafer, the method comprising preparing a plate comprising a plate body having a first surface and a second surface, the plate body having at least one injection passage that spans the plate from the first surface to the second surface, the distance along the passage from the first surface to the second surface defining the length of the passage, wherein the injection passage includes an ion trap chamber, whereby a gas can flow from the first surface of the plate to the second surface of the plate.

A method of preventing electrical contact of a reactant ion with a surface of a cooling plate in a gas dispersion head comprising preparing a gas dispersion plate, wherein the gas dispersion plate comprises a plate body having a first surface and a second surface, the plate body having at least one injection passage that spans the plate from the first surface defining the length of the passage, wherein the injection passage includes an ion trap chamber and wherein the plate body comprises a cooling plate and a cell plate, and a first surface of the cell plate faces the reaction chamber and a second surface of the cell plate faces a first surface of the cooling plate.

25-41. (canceled)