Semiconductor device cooling module

A cooling module for cooling one or more semiconductor devices, comprising:

• a land grid array (LGA) interposer;
• a substrate with an LGA side and a chip side to which a semiconductor device is attachable;
• a cooler including a fluid chamber having a chip side and a clamp side and fluid inlet and outlet openings;
• a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable;
• a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the clamp side of the cooler such that the respective chip sides of the substrate and the cooler are urged toward one another;
• and
• a removable load assembly device that is configured to apply a connection force between the load frame and the LGA interposer to urge the load frame and the LGA interposer together.

A separable and replaceable cooling module for cooling one or more semiconductor devices, comprising:

• a land grid array (LGA) interposer with one or more LGA electrical contacts on a board side thereof that are each connectable to one or more LGA substrate side contacts;
• a substrate with an LGA side and a chip side, the LGA side having one or more substrate LGA side contacts that are each positioned to be in contact with one of the LGA substrate side contacts and that are each connectable to a substrate chip side contact on the chip side that is connectable to a semiconductor chip;
• a separable and removable cooler including:
• a fluid chamber, a spring clamp side, a chip side, and a chamber perimeter joined together to create a fluid chamber, and one or more fluid inlet openings through the spring clamp side, the fluid inlet openings permitting a cooling fluid to enter the fluid chamber and one or more fluid outlet openings through the spring clamp side, the fluid outlet openings permitting the cooling fluid to exit the fluid chamber;
• a load frame attached to the substrate and having an aperture in which the cooler is removably disposable;
• a spring clamp removably attachable to the load frame so that a spring force is applicable to the spring clamp side of the cooler and through the cooler toward the substrate;
• and
• a removable load assembly device that applies a connection force between the loading frame and the LGA interposer to urge the loading frame and the LGA interposer together.