Wafer bonding chamber with dissimilar wafer temperatures
AssigneeInnovative Micro Technology
InventorsChris Gudeman, Jeffery F. Summers, Douglas L. Thompson
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Abstract
A wafer bonding chamber is disclosed, which maintains two wafers to be bonded together at two substantially different temperatures. A lid wafer may be held at a higher temperature than a device wafer, as the device wafer may have delicate structures formed thereon, which cannot withstand higher temperatures. The lid wafer may have an adhesive bonding material formed thereon, which is melted or cured at the higher temperature. The temperature differential may be maintained by applying at least one of a heating mechanism and a cooling mechanism preferentially to one of the wafers to be bonded in the wafer bonding chamber.
Claims20
A wafer bonding chamber, comprising:
- a plurality of fixtures, each supporting one wafer on a frontside of the fixture;
- and
- at least one of a heating mechanism and a cooling mechanism, configured so as to maintain one of the wafers in one of the fixtures at a substantially different temperature than another wafer in another of the plurality of fixtures.
Dependencies are inferred from the claim text.