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US 2013/0170937 A1Published application
Die pickup device with ring-shaped handle portion and die bond system including same
OwnerYi-Zhong Sheuinventor
Life of this patent
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Abstract
Provided is a die pickup device for picking up a die from a wafer and putting the die on a substrate. The die pick device includes a pickup head for picking up the die, a handle portion and a connecting portion connected between the pickup head and the handle portion. The handle portion is substantially ring-shaped and defines a central opening. An end of the connecting portion connected to the pickup head faces toward a center of the central opening.
Claims9
A die pickup device for picking up a die from a wafer and putting the die on a substrate, comprising:
- a pickup head for picking up the die;
- a handle portion, the handle portion being substantially ring-shaped and defining a central opening;
- and
- a connecting portion connected between the pickup head and the handle portion, an end of the connecting portion connected to the pickup head facing toward a center of the central opening.
1 more element
A die bond system for bonding a die to a substrate, comprising:
- a supporting base for supporting and positioning the substrate;
- a die pickup device for picking up the die from a wafer and putting the die on the substrate, comprising:
- a pickup head for picking up the die;
- a handle portion, the handle portion being substantially ring-shaped and defining a central opening;
- and
- a connecting portion connected between the pickup head and the handle portion, an end of the connecting portion connected to the pickup head facing toward a center of the central opening;
- and
- a position detector positioned over the supporting base and configured for detecting a position of the die on the substrate and determining an offset of the die relative to a predetermined mounting position of the die.
5 more elements
Dependencies are inferred from the claim text.