Heat sink mechansim and electronic device using the same
AssigneesHon Hai Precision Industry Co., Ltd., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
InventorXIAO-HUI ZHOU
Life of this patent
Estimating the term…
Abstract
An electronic device includes an electronic component and a heat sink mechanism. The heat sink mechanism includes a first heat sink component and a second heat sink component arranged on opposite surfaces of the electronic component. The first heat sink component includes a first conduction portion and a second conduction portion extending from the first conduction portion. The first conducting portion is secured to the electronic component, and the second conducting portion is secured to the second heat sink component, for dissipating the heat produced by the electronic component away from the electronic device.
Claims20
An electronic device, comprising:
- an electronic component, and;
- a heat sink mechanism that dissipates heat generated by the electronic component;
- the heat sink mechanism comprising:
- a first heat sink component arranged on a surface of the electronic component, the first heat sink component comprising a first conduction portion and a second conduction portion extending from the first conduction portion, and;
- a second heat sink component arranged on a surface opposite to the first heat sink component of the electronic component;
- wherein the first conducting portion is secured to the electronic component, and the second conducting portion is secured to the second heat sink component, for dissipating the heat produced by the electronic component away from the electronic device.
A heat sink mechanism for dissipating the heat of an electronic device, the electronic device comprising an electronic component, the heat sink mechanism comprising:
- a first heat sink component arranged on a surface of the electronic component, the first heat sink component comprising a first conduction portion and a second conduction portion extending from the first conduction portion, and;
- a second heat sink component arranged on a surface opposite to the first heat sink component of the electronic component;
- wherein the first conducting portion is secured to the electronic component, and the second conducting portion is secured to the second heat sink component, for dissipating the heat produced by the electronic component away from the electronic device.
Dependencies are inferred from the claim text.