Method, structure, and design structure for a through-silicon-via wilkinson power divider

A design structure comprising instructions tangibly embodied in a machine readable storage medium for designing, manufacturing, or simulating an integrated circuit, the instructions when executed on a data processing system generate a functional representation of the integrated circuit, design structure comprising:

• an input on a first side of a substrate;
• a first leg comprising a first through-silicon-via in the substrate, wherein the first leg electrically connects the input and a first output;
• a second leg comprising a second through-silicon-via in the substrate, wherein the second leg electrically connects the input and a second output;
• and
• a resistor electrically connected between the first output and the second output,
• wherein the first leg and the second leg are split from the input at a common node, which is connected to the input.