US 2013/0158198 A1 · EPOXY RESIN COMPOSITION AND ITS PREPARING METHOD

Abstract

The invention relates to an epoxy resin composition and preparation thereof. The composition comprises the following blended components: 100 weight parts of epoxy resins; 30 to 120 weight parts of anhydride curing agents; 1 to 45 weight parts of powdery nitrile rubbers; no curing accelerator is included in the composition. The composition of the invention has both higher heat resistance and higher toughness, and is suitable for the fields which require high heat resistance, such as circuit board, electronics packaging, binder and electrical insulating coating etc.

Claims8

Dependent claims

An epoxy resin composition comprising the following blended components:

100 weight parts of epoxy resin;
30 to 120 weight parts, preferably 50 to 90 weight parts of anhydride curing agent;
1 to 45 weight parts, preferably 2 to 29 weight parts, more preferably 3 to 25 weight parts, most preferably 3 to 19 weight parts of powdery nitrile rubber;
No curing accelerator is included in the composition;
Wherein the powdery nitrile rubber are rubber particles having homogeneous structure, mean particle diameter of 20 to 500 nm and gel content of 60 wt % or greater.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

13/701,937Filed 3 Jun 2011

Priority

CN 201010191767.94 Jun 2010

Published

20 Jun 2013

Term ends

Not estimatedThe source records don’t support an estimate.

Classification4 codes

C08L 63/00
Compositions of epoxy resins
C08G 59/42
Characterised by the curing agents used: polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
C08L
Compositions of macromolecular compounds
C08G
Macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds

Epoxy resin composition and its preparing method

Life of this patent

Epoxy resin composition and its preparing method

Life of this patent

Abstract

Claims8