Back to results
US 2013/0158165 A1Published application
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
OwnerSeung HAN, Ju Mi KIM +2inventors
InventorsSeung HAN, Ju Mi KIM, Sung Su PARK, Eun Jung LEE
Life of this patent
Estimating the term…
Abstract
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated with the composition, the composition including an epoxy resin; an inorganic filler; a curing accelerator; and a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1: wherein n is about 1 to about 10.
Claims14
An epoxy resin composition for encapsulating a semiconductor device, the composition comprising:
- an epoxy resin;
- an inorganic filler;
- a curing accelerator;
- and
- a curing agent, the curing agent including a compound having a multifunctional novolac structure including at least one biphenyl moiety, the compound being represented by Formula 1:
- wherein n is about 1 to about 10.
3 more elements
Dependencies are inferred from the claim text.