Active-energy-ray-curable hot-melt urethane resin composition, member for electronic device, the member including the resin composition, and packing

Abstract

An active-energy-ray-curable hot-melt urethane resin composition contains a hot-melt urethane and an active energy ray polymerization initiator, the hot-melt urethane being obtained by converting more than 50% and 100% or less of the total number of isocyanate groups in an isocyanate group-terminated urethane prepolymer into terminal (meth)acryloyl groups by a reaction with hydroxyl groups in a reactive functional group-containing (meth)acrylic compound, the isocyanate group-terminated urethane prepolymer being obtained by reacting a polyisocyanate component with a polyol component that contains an aromatic polyester polyol containing a 2,2-dimethyl-1,3-propylene structure in its molecule in an amount of 90% by mole or more of a glycol component and a polyol other than the aromatic polyester polyol. The hot-melt urethane resin composition has excellent properties such as hot melting, rapid curability, a shape-retaining property after being applied, flexibility, durability, a property of adhering to a base, a low outgas property, mechanical strength, and flame retardancy.

Dependencies are inferred from the claim text.