Photosensitive silicone resin composition
AssigneeAsahi Kasei E-Materials Corporation
InventorsNatsumi Tsugane, Hideo Saito, Toru Kusakabe, Motonori Nakamichi
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AssigneeAsahi Kasei E-Materials Corporation
InventorsNatsumi Tsugane, Hideo Saito, Toru Kusakabe, Motonori Nakamichi
Estimating the term…
Provided is a resin composition which gives a cured product of a photocurable resin having excellent crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R1n1SiX14-n1 (wherein R1, n1 and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si—O—Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0<[Si—O—SiR33]/([Si—O—R2]+[Si—O—SiR33])≦1 (wherein, R2 and R3 are defined in the claims), and has a photopolymerizable functional group.
A photosensitive silicone resin composition comprising (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, wherein:
A production process of a photosensitive silicone resin composition, comprising the following steps:
A production process of a photosensitive silicone resin composition, comprising the following steps:
Dependencies are inferred from the claim text.