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US 2013/0157864 A1Published application
Low temperature resistor for superconductor circuits
AssigneeNorthrup Grumman Systems Corporation
InventorsJohn J. Talvacchio, Erica C. Folk, Sean R. McLaughlin, David J. Phillips
Life of this patent
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Abstract
A integrated circuit and methods for fabricating the circuit are provided. The circuit integrates at least one circuit element formed from a material that is superconducting at temperatures less than one hundred milliKelvin and at least one resistor connected to the circuit element. The resistor is formed from an alloy of transition metals that is resistive at temperatures less than one hundred milliKelvin.
Claims20
An integrated circuit comprising:
- a circuit element formed from a material that is superconducting at temperatures less than one hundred milliKelvin;
- and
- a resistor connected to the circuit element, the resistor being formed from an alloy of transition metals that is resistive at temperatures less than one hundred milliKelvin.
A method for creating a superconducting circuit comprising:
- depositing a first layer of material that is superconducting at temperatures less than one hundred milliKelvin on an insulating substrate;
- and
- depositing a second layer of material comprising an alloy of transition metals, the alloy comprising at least two of titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tungsten, tantalum, and rhenium, that remains resistive at temperatures less than one hundred milliKelvin, the second layer of material being in contact with the first layer of material.
An integrated circuit comprising:
- a circuit element formed from a superconducting material;
- and
- a resistor connected to the circuit element, the resistor being formed from an alloy of transition metals having an atomic ratio selected such that a ratio of the number of valance electrons to atoms within the alloy is between about 5.35 and about 5.95.
Dependencies are inferred from the claim text.