Methods for stripping photoresist and/or cleaning metal regions
AssigneeNovellus Systems, Inc.
InventorsDavid Chen, Haruhiro Harry Goto, Martina Martina, Frank Greer, Shamsuddin Alokozai
Life of this patent
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Abstract
Methods are provided for cleaning metal regions overlying semiconductor substrates. A method for removing material from a metal region comprises heating the metal region, forming a plasma from a gas comprising hydrogen and carbon dioxide, and exposing the metal region to the plasma.
Claims20
A method for removing material from a metal region overlying a semiconductor substrate, the method comprising:
- forming a plasma from a gas comprising hydrogen and carbon dioxide;
- and
- exposing the metal region to the plasma to thereby remove material from the metal region of the semiconductor substrate.
A method for cleaning a metal region overlying a semiconductor substrate, the method:
- exciting a gas, wherein the gas comprises hydrogen and carbon dioxide;
- and
- subjecting the metal region to the excited gas to thereby clean the metal region of the semiconductor substrate.
A method for fabricating a semiconductor structure including a metal region, the method comprising:
- heating the metal region;
- exciting a gas to form a plasma, wherein the gas comprises hydrogen and carbon dioxide;
- subjecting the metal region to a plasma to thereby remove material from the metal region;
- and
- forming an insulating layer overlying the metal region.
Dependencies are inferred from the claim text.