Substrate sheet

A method for producing a flexible sheet comprising a barrier layer and metallic elements, intended as a substrate sheet for the manufacture of a thin film semiconductor device, said method comprising:

• a) providing a metallic layer applied on a polymeric support layer, the metallic layer having a first surface facing the polymeric support layer and a second surface (106) facing away from said polymeric support layer;
• b) providing metallic elements on the second surface of the metallic layer;
• c) providing a barrier layers covering said second surface of the metallic layer and said metallic elements, the barrier layer having a first surface facing the metallic layer and a second surface (108) facing away from the metallic layer;
• d) releasing the polymeric support layer from the metallic layer;
• and
• e) removing the metallic layer from the metallic elements and the barrier layer, wherein the metallic layer has a melting temperature which is higher than the evaporation temperature of the polymeric support layer, and wherein the metallic layer is heated to a temperature which is equal to or higher than the evaporation temperature of the polymeric support layer, but lower than the melting temperature of the metallic layer.