Method of manufacturing substrate for mounting electronic device
AssigneeSamsung Electronics Co., Ltd.
InventorsJong Wan SEO, Hyung Kun KIM
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Abstract
A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.
Claims15
A method of manufacturing a substrate for mounting an electronic device, the method comprising steps of:
- forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof;
- forming an electrode substrate having at least one core on an upper surface thereof, such that the at least one core corresponds to the at least one through-hole;
- coupling the electrode substrate to the substrate body by inserting the at least one core into the at least one through-hole;
- and
- removing a portion of the coupled electrode substrate except for the at least one core.
A method of manufacturing a substrate for mounting an electronic device, the method comprising steps of:
- coupling an electrode substrate having at least one core on an upper surface thereof, to a plate-shaped substrate body having at least one through-hole defined in a thickness direction of the substrate body, by inserting the at least one core into the at least one through-hole;
- and
- removing a portion of the coupled electrode substrate except for the at least one core.
Dependencies are inferred from the claim text.