Stacked-die package and method therefor

A semiconductor device comprised of a combination of device die, the semiconductor device comprising:

• a package substrate having groups of pad landings;
• a first device die anchored to the package substrate, the first device die wire-bonded to a first group of pad landings;
• and
• at least one subsequent device die anchored to the first device die, the at least one subsequent device die having an underside profile with recesses defined therein, the recesses of a size defined to accommodate wires bonded to the first device die, the at least one subsequent device wire bonded to a second group of pad landings.

A method for assembling combination semiconductor devices, the method comprising:

• defining a package substrate for assembling the combination of semiconductor devices;
• providing a wafer having functional devices;
• applying a die attach film (DAF) to the wafer underside;
• making a partial first cut with a blade of a first kerf at device boundaries through the DAF and the wafer underside;
• making a second cut at device boundaries with a blade of a second kerf, the second kerf wider than the first kerf, the second cut forming recesses on the underside of devices;
• separating out functional devices for use as subsequent devices;
• attaching a first device to the package substrate;
• wire-bonding the first device;
• attaching the subsequent device to a defined area on the first device;
• wire-bonding the subsequent device;
• determining whether all devices have been combined,
• if no, attaching another subsequent device to a defined area on the subsequent device;
• if yes, encapsulating the first and subsequent devices.