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US 2013/0157412 A1Published application
Chip on wafer bonder
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Jui-Pin Hung, Weng-Jin Wu, Jean Wang, Wen-Chih Chiou
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Abstract
The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.
Claims20
A chip-to-wafer bonding method, comprising:
- loading a plurality of chips to a chip-to-wafer bonding apparatus having:
- a cleaning module designed for cleaning the plurality of chips;
- and
- a chip-to-wafer bonding chamber configured to receive the plurality of chips from the cleaning module and designed to bond the plurality of chips to a wafer;
- cleaning the plurality of chips;
- and
- bonding the plurality of chips to a wafer.
4 more elements
A method comprising:
- cleaning a chip within a cleaning module of a chip-to-wafer bonding apparatus, wherein cleaning the chip within the cleaning module includes providing a cleaning material that removes oxide from the chip and providing a protective material that protects the chip from oxidation occurring on the chip;
- and
- bonding the chip to a wafer within a bonding module of the chip-to-wafer bonding apparatus, the bonding module being different than the cleaning module.
The method of claim of 11, wherein moving the chip from the proximal portion to the distal portion of the cleaning module includes moving by a conveyor belt.
A method comprising:
- cleaning a chip within a cleaning module of a chip-to-wafer bonding device, wherein cleaning the chip within the cleaning module includes:
- providing a cleaning material that removes oxide from the chip;
- and
- providing a protective material that protects the chip from oxidation occurring on the chip, wherein providing the protective material includes providing the protective material on either side of the cleaning material;
- and
- bonding the chip to a wafer within a bonding module of the chip-to-wafer bonding device, the bonding module being different than the cleaning module.
3 more elements
Dependencies are inferred from the claim text.