Multiple-Patterning Overlay Decoupling Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Chuan Wang, Shy-Jay Lin, Pei-Yi Liu, Jaw-Jung Shin, Burn Jeng Lin
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Chuan Wang, Shy-Jay Lin, Pei-Yi Liu, Jaw-Jung Shin, Burn Jeng Lin
Estimating the term…
A method for fabricating a semiconductor device is disclosed. An exemplary method includes forming a first structure in a first layer by a first exposure and determining placement information of the first structure. The method further includes forming a second structure in a second layer overlying the first layer by a second exposure and determining placement information of the second structure. The method further includes forming a third structure including first and second substructures in a third layer overlying the second layer by a third exposure. Forming the third structure includes independently aligning the first substructure to the first structure and independently aligning the second substructure to the second structure
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