Profile method in magnetic write head fabrication

A method for manufacturing a magnetic write head, the method comprising:

• providing a wafer;
• depositing a magnetic write pole material on the wafer;
• depositing an etch stop layer above the magnetic write pole material;
• depositing a polymer mask under-layer above the etch stop layer;
• depositing a dielectric hard mask layer above the under-layer;
• forming a photoresist mask over the dielectric hard mask layer;
• transferring the image of the photoresist mask onto the hard mask layer using reactive ion etching, thereby defining a hard mask;
• determining that a critical dimension bias of the hard mask is within or outside a specification;
• performing subsequent processing on the wafer when the critical dimension bias of the hard mask is within the specification;
• and
• removing the hard mask when the critical dimension bias of the hard mask is outside the specification and repeating the forming the photoresist mask and the transferring using a different level of an input source power for the reactive ion etching, the different level being selected based on the determining.