Device mounting board, cell, and battery module
AssigneeSanyo Electric Co., Ltd.
InventorsMasayuki NAGAMATSU, Mayumi NAKASATO, Yasuyuki YANASE
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Abstract
A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.
Claims5
A device mounting board comprising:
- a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti;
- an insulting resin layer laminated on the heat dissipating substrate;
- and
- a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted,
- wherein the heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.
A cell comprising:
- an electrode body;
- a housing configured to house the electrode body, and formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti;
- and
- an external terminal which is configured as an external terminal of the housing, and which is electrically connected to the electrode body
- wherein the housing is configured such that a random porous layer formed on an inner face side of the housing has cavities elongated in respective random directions.
A battery module comprising:
- a plurality of cells which are arranged together, and each of which comprises an electrode body, a housing which is configured to house the electrode body, and an external terminal electrically connected to the electrode body;
- and
- a connecting member configured to electrically connect the respective external terminals of the plurality of cells,
- wherein the connecting member comprises:
- a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti;
- an insulating resin layer laminated on the heat dissipating substrate;
- and
- a wiring layer laminated on the insulating resin layer, and configured to electrically connect the respective external terminals,
- and wherein the heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and configured to have cavities elongated in respective random directions.
Dependencies are inferred from the claim text.