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US 2013/0157048 A1Published application
Sealing membrane with improved adhesion
AssigneeSika Technology AG
InventorJean-Claude Rudolf
Life of this patent
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Abstract
The invention relates to a sealing membrane comprising a thermoplastic barrier layer and a tack-free solid epoxy resin layer which is suitable for sealing substrates in the construction industry. The invention further relates to a method for sealing said substrates. Said method allows rapid and efficient sealing of structures in civil engineering and good adhesion of the sealing membrane on the substrate.
Claims14
A sealing membrane comprising
- a thermoplastic barrier layer, having thermoplastic polyolefins or polyvinyl chloride (PVC), and a tack-free solid epoxy resin layer.
Dependencies are inferred from the claim text.