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US 2013/0157011 A1Published application
Resin substrate and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSung Nam Cho, Jun Young Kim, Tae Hoon Kim, Young Kwan Seo
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Abstract
Disclosed herein is a resin substrate, including: an insulating material; and a resin layer formed on the insulating material and having surface roughness.
Claims20
A resin substrate, comprising:
- an insulating material layer;
- and
- a resin layer formed on the insulating material and having surface roughness.
A method of manufacturing a resin substrate, comprising:
- providing an insulating material;
- forming a resin layer containing particles on the insulating material by an ink-jet process;
- and
- removing the particles from the resin layer by a desmear process to impart a surface of the resin layer with roughness.
1 more element
Dependencies are inferred from the claim text.