Back to results
US 2013/0156971 A1Published application
Transparent conductive- and ito-replacement materials and structures
AssigneeLiquid X Printed Metals, Inc.
InventorsRichard D. MCCULLOUGH, John Belot, Elizabeth Sefton
Life of this patent
Estimating the term…
Abstract
Provided herein are methods comprising (i) depositing an ink on a surface, (ii) producing a conductive metal film by, for example, heating or irradiating or other treatment of said ink, and (iii) wherein the metal film is in the form of a repetitively patterned structure forming a grid-like network of vertex-shared polygons and polygon-like structures with a varying number of vertices. Transparent, conductive structures can be formed and serve as, for example, ITO-replacement materials and structures.
Claims34
A method comprising:
- depositing an ink on a surface, and
- producing a conductive metal film by a treatment of said ink,
- wherein the metal film is in the form of a repetitively patterned structure forming a grid-like network of vertex-shared polygons and polygon-like structures with a varying number of vertices, and
- (i) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is a sigma donor to the metal and volatilizes upon heating the metal complex, and at least one second ligand different from the first which also volatilizes upon heating the metal complex, wherein the metal complex is soluble in a solvent at 25° C.;
- or
- (ii) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is an amino ligand, and at least one second ligand different from the first which, optionally, is a carboxylate, wherein the metal complex is soluble in a solvent at 25° C.;
- or
- (iii) wherein the ink comprises a composition comprising at least one neutral metal complex comprising at least one metal in a (I) or (II) oxidation state, and at least two ligands, wherein at least one first ligand is a neutral sigma donor to the metal and volatilizes upon heating the metal complex to a temperature below 150° C., and at least one second anionic ligand different from the first which also volatilizes upon heating the metal complex to a temperature below 150° C., wherein, optionally, the metal complex is soluble in a solvent at 25° C.
5 more elements
3-6. (canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
26-27. (canceled)
29-31. (canceled)
35-37. (canceled)
A method comprising:
- depositing an ink on a surface to form a deposit, converting the deposit to a metal film, wherein the metal film shows a work function which is within 25 percent of the work function of the pure metal, wherein the metal film is in the form of a repetitively patterned structure,
- (i) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is a sigma donor to the metal and volatilizes upon heating the metal complex, and at least one second ligand different from the first which also volatilizes upon heating the metal complex, wherein the metal complex is soluble in a solvent at 25° C.;
- or
- (ii) wherein the ink comprises a composition comprising at least one metal complex comprising at least one metal and at least two ligands, wherein at least one first ligand is an amino ligand, and at least one second ligand different from the first which, optionally, is a carboxylate, wherein the metal complex is soluble in a solvent at 25° C.;
- or
- (iii) wherein the ink comprises a composition comprising at least one neutral metal complex comprising at least one metal in a (I) or (II) oxidation state, and at least two ligands, wherein at least one first ligand is a neutral sigma donor to the metal and volatilizes upon heating the metal complex to a temperature below 150° C., and at least one second anionic ligand different from the first which also volatilizes upon heating the metal complex to a temperature below 150° C., wherein, optionally, the metal complex is soluble in a solvent at 25° C.
3 more elements
40-58. (canceled)
A method comprising:
- depositing at least one precursor composition on at least one substrate to form at least one deposited structure, wherein the precursor composition comprises at least two metal complexes, including at least one first metal complex comprising at least one first metal and at least one second metal complex different from the first metal complex and comprising at least one second metal different from the first metal,
- treating the deposited structure so that the first metal and the second metal form elemental forms of the first metal and the second metal in a treated structure, and
- wherein the treated structure is a metallic repetitively patterned structure comprising lines and holes.
60-78. (canceled)
Dependencies are inferred from the claim text.