Substrate processing apparatus, substrate processing method and storage medium

A substrate processing method comprising:

• discharging a first chemical liquid toward the peripheral portion of a substrate by a first chemical liquid nozzle disposed in a first processing position, thereby performing a liquid processing for the peripheral portion of the substrate by the first chemical liquid while rotating the substrate held by a substrate holding unit;
• and
• discharging a second chemical liquid toward the peripheral portion of the substrate by a second chemical liquid nozzle disposed in a second processing position thereby performing the liquid processing for the peripheral portion of the substrate by the second chemical liquid while rotating the substrate held by the substrate holding unit,
• wherein the first chemical liquid nozzle is disposed in a first stand-by position located at the center side of the substrate compared to the first processing position, while the second chemical liquid nozzle discharges the second chemical liquid toward the substrate, and
• the second chemical liquid nozzle is disposed in a second stand-by position located at the center side of the substrate compared to the second processing position, while the first chemical liquid nozzle discharges the first chemical liquid toward the substrate.

A storage medium that stores a computer program that, when executed, causes a computer to perform a substrate processing method in a substrate processing apparatus, the substrate processing method comprising:

• discharging a first chemical liquid toward the peripheral portion of the substrate by a first chemical liquid nozzle disposed in a first processing position, thereby performing a liquid processing for the peripheral portion of the substrate by the first chemical liquid while rotating the substrate held by a substrate holding unit;
• and
• discharging a second chemical liquid toward the peripheral portion of the substrate by a second chemical liquid nozzle disposed in a second processing position, thereby performing the liquid processing for the peripheral portion of the substrate by the second chemical liquid while rotating the substrate held by the substrate holding unit,
• wherein the first chemical liquid nozzle is disposed in a first stand-by position located at the center side of the substrate compared to the first processing position, when the second chemical liquid nozzle discharges the second chemical liquid toward the substrate, and
• the second chemical liquid nozzle is disposed in a second stand-by position located at the center side of the substrate compared to the second processing position, when the first chemical liquid nozzle discharges the first chemical liquid toward the substrate.