System and Method for Aligning Sputter Sources
AssigneeIntermolecular, Inc.
InventorsDanny Wang, Kent Riley Child, Owen Ho Yin Fong
Life of this patent
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Abstract
Embodiments provided herein describe systems and methods for aligning sputtering sources, such as in a substrate processing tool. The substrate processing tool includes at least one sputtering source and a device. Each of sputtering sources includes a target having a central axis. The device has an axis and is detachably coupled to the at least one sputtering source. The device indicates to a user a direction in which the central axis of the target of the at least one sputtering source is oriented.
Claims20
A substrate processing tool comprising:
- a plurality of sputtering sources, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target;
- and
- a device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the sputtering source when the device is coupled to one of the plurality of sputtering sources.
A method comprising:
- providing a plurality of sputtering sources positioned within a processing chamber, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target;
- attaching a device to a first of the plurality of sputtering sources, the device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the first of the plurality of sputtering sources when the device is attached to the first of the plurality of sputtering sources;
- determining a direction in which the central axis of the target of the first of the plurality of sputtering sources is oriented using the device;
- attaching the device to a second of the plurality of sputtering sources, wherein the indicator of the device is aligned with the central axis of the target of the second of the plurality of sputtering sources when the device is attached to the second of the plurality of sputtering sources;
- and
- determining a direction in which the central axis of the target of the second of the plurality of sputtering sources is oriented using the device.
A substrate processing tool comprising:
- a housing defining a processing chamber;
- a substrate support coupled to the housing and configured to support a substrate within the processing chamber;
- a plurality of sputtering sources coupled to the housing and positioned within the processing chamber above the substrate support, each of the plurality of sputtering sources comprising a target, wherein each target has a central axis perpendicular to a plane of the target;
- and
- a device having a central axis and an indicator aligned with the central axis of the device, wherein the indicator of the device is aligned with the central axis of the target of the respective sputtering source when the device is coupled to one of the plurality of sputtering sources.
Dependencies are inferred from the claim text.