Method and apparatus for reducing contamination of substrate

Abstract

An aligner, chuck, and end effector for substrate processing are provided. The aligner includes a rotatable substrate support having a surface for supporting the substrate. The rotatable substrate support has a diameter less than a diameter of the substrate and surfaces of the rotatable substrate support are coated with a coating consisting essentially of a poly(p-xylylene) polymer. The chuck includes a flat platform that supports the substrate during processing. The chuck is larger than the substrate and may include holes though which lift pins can pass assist the loading/unloading of the substrate. The end effector includes an arm supporting a first extension and a second extension, wherein the arm, the first extension and the second extension are coated with a coating consisting essentially of a poly(p-xylylene) polymer.

Dependencies are inferred from the claim text.