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US 2013/0156365 A1Published application
Fiber to Wafer Interface
AssigneesUS Conec Ltd., International Business Machines Corporation
InventorsTymon Barwicz, Darrell R. Childers, Dan Kurtz
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Abstract
An interface device includes a body portion having a single-mode waveguide portion including a substantially optically transparent material, a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material, an engagement feature operative to engage a portion of a wafer, and a guide portion operative to engage a portion of an optical fiber ferrule.
Claims25
An interface device comprising:
- a body portion comprising:
- a single-mode waveguide portion including a substantially optically transparent material;
- a cladding portion defined by channels contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material;
- an engagement feature operative to engage a portion of a wafer;
- and
- a guide portion operative to engage a portion of an optical fiber ferrule.
3 more elements
A fiber to wafer interface system comprising:
- an interface device comprising:
- a polymer material
- a single-mode waveguide portion including a substantially optically transparent material;
- a cladding portion contacting the waveguide portion, the cladding portion including a substantially optically transparent polymer material;
- and
- a guide portion operative to engage a portion of an optical fiber ferrule;
- a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer;
- and
- an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.
6 more elements
Dependencies are inferred from the claim text.