Light emitting device, and method for manufacturing the same

A light emitting device, comprising:

• a package constituted by a molded article and a lead, the lead being embedded in the molded article, the package formed in a substantially cuboid shape;
• and
• a light emitting element installed in the package,
• the lead has a connector and an exposed part, the light emitting element mounted on the connector, the exposed part linked to the connector,
• the package having a bottom face, a light emission face contiguous with the bottom face, and a rear face contiguous with the bottom face, the rear face being opposite the light emission face, and
• the terminal part and the exposed part linked to a rear face side of the connector, the terminal part and the exposed part continuously exposed from the molded article at the bottom face and rear face, the terminal part and the exposed part being apart from each other at a bottom face side of the rear face.

A package array for a light emitting device, comprising:

• a molded board made of resin;
• and
• a lead frame embedded in the molded board, the lead frame formed in a thin plate shape, the lead frame having a first frame component and a second frame component adjacent to the first frame component in a specific direction,
• the first frame component and the second frame component each including:
• a first thick part exposed from the molded board with a first thickness;
• a second thick part exposed from the molded board with the first thickness, the second thick part separated from the first thick part in the specific direction;
• a first thin part linked to the first thick part and the second thick part with a second thickness less than the first thickness;
• a second thin part linked to the second thick part with the second thickness, the second thin part separated from the first thin part in the specific direction;
• and
• the second thick-walled part includes a concavity that is exposed from the molded board with the second thickness and.

A method for manufacturing a package array for a light emitting device, comprising:

• a double-sided etching step of forming etching holes in a thin metal plate by etching a first main face and a second main face opposite to the first main face of the thin metal plate;
• a one-sided etching step of forming a lead frame in a specific shape by forming an etching concave component in a second pattern on the first main face, the etching concave component is formed by etching part of the first main face of the thin metal plate;
• and
• a molding step of forming a molded board in which the lead frame is embedded by injecting resin into a metal mold in which the lead frame is disposed, wherein the lead frame has a thick part that constitutes an exposed part linked to a mounting part for mounting a light emitting element, and a thin part that constitutes a connected part separated from the mounting part with the etching holes in between.