3d non-volatile memory device, memory system including the same, and method of manufacturing the same
AssigneeSK hynix Inc.
InventorSuk Goo KIM
Life of this patent
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Abstract
A three-dimensional 3D nonvolatile memory device includes vertical channel layers protruding from a substrate; interlayer insulating layers and conductive layer patterns alternately deposited along the vertical channel layers; a barrier metal pattern surrounding each of the conductive layer patterns; a charge blocking layer interposed between the vertical channel layers and the barrier metal patterns; and a diffusion barrier layer interposed between the barrier metal patterns and the charge blocking layer.
Claims17
A 3-Dimensional (3D) non-volatile memory device comprising:
- vertical channel layers protruding from a substrate;
- interlayer insulating layers and conductive layer patterns alternately deposited along the vertical channel layers;
- a barrier metal pattern surrounding each of the conductive layer patterns;
- a charge blocking layer interposed between the vertical channel layers and the barrier metal patterns;
- and
- a diffusion barrier layer interposed between the barrier metal patterns and the charge blocking layer.
A memory system comprising:
- a 3D non-volatile memory device comprising:
- vertical channel layers protruding from a substrate,
- interlayer insulating layers and conductive layer patterns alternately deposited along the vertical channel layers,
- a barrier metal pattern surrounding each of the conductive layer patterns,
- a charge blocking layer interposed between the vertical channel layers and the barrier metal patterns, and
- a diffusion barrier layer interposed between the barrier metal patterns and the charge blocking layer;
- and
- a memory controller configured to control the 3D non-volatile memory device.
A method of manufacturing a 3D non-volatile memory device, comprising:
- alternately depositing first material layers and second material layers on a substrate;
- forming vertical channel layers passing through the first material layers and the second material layers;
- forming a slit between the vertical channel layers by etching the first material layers and the second material layers;
- forming trenches by removing the second material layers exposed through the slit;
- sequentially forming a charge blocking layer, a diffusion barrier layer, and a barrier metal layer along a surface of the slit and along surfaces of the trenches;
- forming a conductive layer filling the trenches on the barrier metal layer;
- and
- etching the conductive layer, the barrier metal layer, and the diffusion barrier layer from the surface of the slit between each of the trenches, so that the conductive layer, the barrier metal layer, and the diffusion barrier layer formed in one of the trenches is separated from the conductive layer, the barrier metal layer, and the diffusion barrier layer formed in another one of the trenches.
Dependencies are inferred from the claim text.