Relay module

Abstract

Disclosed herein is an improved relay for replacing an electro-mechanical relay and converting the original electro-mechanical relay to a solid state relay. The improved relay includes a housing module having an interior. The interior includes a plurality of existing relay tabs and wires. The wires electrically connect the tabs to a connection member. The invention also includes a solid state relay member having a solid state relay module. The module includes a plurality of solid state relay contacts, each corresponding to the existing tabs. The plurality of solid state relay contacts are mounted on, for example, a PC board and adapted for connection to the housing module connection member. Additionally, the existing relay includes a power tab and the wires and connection member are adapted to provide power to the solid relay module for powering each of the solid state relay contacts.

Dependencies are inferred from the claim text.