Electronic component and method for manufacturing the same

A method for manufacturing an electronic component, comprising:

• a first step of preparing a multi-piece board including a substrate including a first principle surface and a second principle surface that faces the first principle surface;
• wherein
• the substrate includes plural portions that are to be separated and become plural individual boards;
• in each of the plural portions that become the individual boards, a ground electrode is formed so as to reach an outer edge of the portions that becomes the individual boards;
• in each of the plural portions that become the individual boards, a first electronic component is mounted on the first principle surface;
• in each of the plural portions that become the individual boards, a second electronic component is mounted on the second principle surface;
• a first resin layer is formed on the first principle surface so as to cover the first principle surface and the first electronic component;
• and
• a second resin layer is formed on the second principle surface so as to cover the second principle surface and the second electronic component;
• a second step of forming closed-bottom trenches in the multi-piece board by cutting the first resin layer, the substrate, and a portion of the second resin layer on a substrate side from a principle surface of the first resin layer, which is on an opposite side to the substrate, so that the substrate is separated into the individual boards, the second step exposing the ground electrode at a cut surface of the substrate;
• a third step that forms a shield layer inside the closed-bottom trenches and on the principle surface of the first resin layer, which is on the opposite side to the substrate, by using an electrically conductive material so that the shield layer is in contact with and electrically connected to the ground electrode that is exposed;
• and
• a fourth step that separates the multi-piece board into individual pieces by cutting the multi-piece board along cutting lines along which the substrate is separated.