Hermetic Semiconductor Package Structure and Method for Manufacturing the same
AssigneeTong Hsing Electronic Industries, Ltd.
InventorShao-Pin Ru
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Abstract
The invention provides a semiconductor package structure, comprising: a substrate having a first surface and a second surface; a first conductive layer plated on the first surface; a semiconductor element attached to the first conductive layer on the first surface of the substrate for electrically connecting; a second conductive layer plated on the first surface and surrounded the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer; and a lid attached to the top of the second conductive layer for sealing the semiconductor element.
Claims26
A semiconductor package structure, comprising:
- a substrate having a first surface, a second surface and a metal contact penetrating the substrate from the first surface to the second surface;
- a first conductive layer which is plated on the first surface of the substrate and connected to the metal contact;
- a semiconductor element electrically connecting the first conductive layer on the first surface of the substrate;
- a second conductive layer which is plated on the first surface of the substrate surrounding the first conductive layer and the semiconductor element, wherein the height of the second conductive layer is higher than the height of the first conductive layer;
- and
- a lid attached to the top of the second conductive layer for sealing the semiconductor element.
A method for manufacturing semiconductor package structure, comprising the steps of:
- (a) providing a substrate having a first surface, a second surface and an opening penetrating the substrate from the first surface to the second surface;
- (b) forming a metal contact in the opening;
- (c) plating a first conductive layer on the first surface of the substrate, wherein the first conductive layer electrically connects to the metal contact;
- (d) plating a second conductive layer on the first surface of the substrate for surrounding the semiconductor element and the first conductive layer, wherein the height of the second conductive layer is higher than the first conductive layer;
- (e) attaching a semiconductor element to the first conductive layer on the first surface of the substrate for electrically connecting;
- and
- (f) attaching a lid to the top of the second conductive layer for sealing the semiconductor element.
Dependencies are inferred from the claim text.