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US 2013/0155622 A1Published application
Electronic device with heat dissipation apparatus
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsYAO-TING CHANG, HUNG-CHOU CHAN
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Abstract
A heat dissipation apparatus for an electronic component mounted in a casing of an electronic device includes a first heat sink attached to the component, a second heat sink located outside the casing, and a heat pipe connected between the first heat sink and the second heat sink. The heat pipe contacts the casing.
Claims10
A heat dissipation apparatus for cooling an electronic component received in a casing, comprising:
- a first heat sink thermally attached to the electronic component;
- a second heat sink located outside the casing;
- and
- a heat pipe thermally connected between the first heat sink and the second heat sink, wherein the heat pipe thermally contacts the casing.
1 more element
An electronic device comprising:
- a metal casing;
- a motherboard mounted in the casing and comprising an electronic component;
- and a heat dissipation apparatus comprising a first heat sink thermally attached to the electronic component, a second heat sink located outside the metal casing, and a heat pipe thermally connected between the first heat sink and the second heat sink, wherein the heat pipe thermally contacts the casing.
Dependencies are inferred from the claim text.