Package

An electronic component package comprising:

• a support;
• and
• a heat conductor;
• wherein the heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance;
• wherein the socket has an exit point and there is conductive sticking material attached to the exit point;
• and
• wherein the protuberance extends beyond the exit point of the socket.

An electronic device, comprising:

• a support, the support including a plurality of sockets;
• an electronic component mounted on the support;
• and
• a heat conductor comprising a plurality of pins, each pin disposed within a respective one of the sockets, wherein each pin extends beyond an exit point of the respective socket.

A heat conductor comprising:

• a central region of thermally conductive material;
• a peripheral region surrounding the central region;
• and
• a plurality of protuberances extending from the peripheral region, the protuberances spaced from each other around the peripheral region.

A method comprising:

• providing a heat conductor having a protuberance;
• providing a support with an electronic component attached thereto, the support having a socket arranged to receive the protuberance;
• positioning the heat conductor so that the protuberance is inserted into the socket and extends beyond an exit point of the socket;
• and
• applying a conductive sticking material so as to form a joint between the protuberance and the socket.