US 2013/0155597 A1 · Molded Part for a Portable Electronic Device

Abstract

A molded part that has a relatively small thickness so that it can be readily employed in portable electronic devices is provided. The molded part is formed from a thermoplastic composition that contains a polyarylene sulfide and an aromatic amide oligomer. Due to the improved crystallization rate, the thermoplastic composition can be molded at lower temperatures to still achieve the same degree of crystallization. In addition to minimizing the energy requirements of the molding operating, the use of lower temperatures can also decrease the production of “flash” normally associated with high temperature molding operations. The composition may also possess good viscosity properties that allow it to be readily molded into parts of a variety of different shapes and sizes.

Claims29

Dependent claims

A molded part for a portable electronic device, wherein the part has a thickness of about 100 millimeters or less and is formed from a thermoplastic composition that comprises a polyarylene sulfide and an aromatic amide oligomer having the following general formula (I):

wherein,
ring B is a 6-membered aromatic ring wherein 1 to 3 ring carbon atoms are optionally replaced by nitrogen or oxygen, wherein each nitrogen is optionally oxidized, and wherein ring B may be optionally fused or linked to a 5- or 6-membered aryl, heteroaryl, cycloalkyl, or heterocyclyl;
R5 is halo, haloalkyl, alkyl, alkenyl, alkynyl, aryl, heteroaryl, cycloalkyl, or heterocyclyl;
m is from 0 to 4;
X1 and X2 are independently C(O)HN or NHC(O);
and
R1 and R2 are independently selected from aryl, heteroaryl, cycloalkyl, and heterocyclyl.

4 more elements

Dependencies are inferred from the claim text.

Molded Part for a Portable Electronic Device

Life of this patent

Molded Part for a Portable Electronic Device

Life of this patent

Abstract

Claims29